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Publications

April - 2023

C. -Y. Lin, R. -Y. Huang, M. Teng and Y. -C. Wu, "Pulsed Eddy Current Sensor for Cascade Electrical Conductivity and Thickness Estimation in Nonferrous Metal Plates," in IEEE Sensors Journal, vol. 23, no. 8, pp. 8323-8334, 15 April15, 2023, doi: 10.1109/JSEN.2023.3257316.

Jan - 2023

F. Xia, Y. Peng, S. Pala, R. Arakawa, W. Yue, P.-C. Tsao, C.-M. Chen, H. Liu, M. Teng, J. Park, and L. Lin, "High-SPL and Low-Driving-Voltage pMUTs by Sputtered Potassium Sodium Niobate," 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), Munich, Germany, 2023, pp. 135-138, doi: 10.1109/MEMS49605.2023.10052391.

Feb - 2023

C. -Y. Lin, Y. -C. Wu and M. Teng, "Development of a Magnetic/Eddy-Current Sensing System For Simultaneous Estimation of Electrical Conductivity and Thickness in Non-Ferrous Metal Plates," in IEEE/ASME Transactions on Mechatronics, vol. 28, no. 1, pp. 360-371, Feb. 2023, doi: 10.1109/TMECH.2022.3199821.

Jan - 2023

C. -Y. Lin, Y. -C. Wu, Z. -H. Kuo, H. -Y. Ma and M. Teng, "Analytical and Experimental Investigation of Electromagnetic Tracking System for Location and Orientation Estimation," in IEEE Access, vol. 11, pp. 9931-9941, 2023, doi: 10.1109/ACCESS.2023.3239262.

Dec - 2022

Chun-Yeon Lin, Yi-Chin Wu, and Megan Teng, “Development of a Magnetic/EddyCurrent Sensing System For Simultaneous Estimation of Electrical Conductivity and Thickness in Non-Ferrous Metal Plates,” IEEE/ASME Transactions on Mechatronics, pp. 1–12, 2022, doi: 10.1109/TMECH.2022.3199821.C

Aug - 2022

Y. -C. Wu, H. -Y. Ma, Z. -H. Kuo, M. Teng and C. -Y. Lin, "Electromagnetic Tracking System Design for Location and Orientation Estimation," 2022 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), Sapporo, Japan, 2022, pp. 1256-1262, doi: 10.1109/AIM52237.2022.9863273.

Jul - 2022

Chun-Yeon Lin, Yi-Chin Wu, Megan Teng, and Kuan-Cheng Chen, "Time Domain Characteristics of Metal Magnetic/Eddy-current Sensor," The 18th International Conference on Automation Technology (Automation 2021), Nov. 2021

Best Paper Competition-Silver

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